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Please use this identifier to cite or link to this item: http://hdl.handle.net/2080/813

Title: Morphological study of electrodeposited copper under the influence of ultrasound and low temperature
Authors: Mallik, A
Ray, B C
Keywords: Electrodeposit
Ultrasound
Temperature
copper
Issue Date: 2009
Publisher: Elsevier
Citation: Thin Solid Films (Accepted Postprint)
Abstract: The effects of temperature and cavitation on the electrochemistry principle were experimented here by adding the impact of sonication to synthesize ultrafine grained deposits at low temperatures. The X-ray diffraction analysis and microscopic studies confirmed the nanorange deposit. Scanning electron microscopy images have also confirmed the powdery and highly scattered deposits in silent conditions. Ultrasound was found to have a significant effect on the deposit morphology. The deposit obtained was compact, uniform and adherent. Energy dispersive spectroscopy result of the deposits revealed an oxidized silent deposit along with some adsorbed sulfur onto the electrode surface. In contrary the in-situ cleaning associated with sonication has resulted in cleaner deposits.
Description: Copyright for the published version belongs to Elsevier
URI: http://hdl.handle.net/2080/813
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