Please use this identifier to cite or link to this item:
Title: Thin film electrodeposition of nanostructured copper in presence of ultrasound
Authors: Sahoo, S
Sahoo, Rakesh K
Mallik, A
Ray, B C
Issue Date: 2008
Publisher: Guru Ghasidas University, Bilaspur
Citation: 10th Conference of International Academy of Physical Sciences CONIAPS-X, January 12-14 2008, Guru Ghasidas University, Bilaspur, India
Abstract: Electrodeposition of copper thin films of the order 4 μm was carried out potentiostaticlly on metallic substrates with and without the presences of ultrasound. A simple acidic solution without any additives served the medium of deposits.Crystallinity and other details of average domain size and strain were carefully analyzed by X-ray diffraction (XRD) studies.Comparision of the line plots gives the highly crystallinity nature of copper deposits in presences of ultrasound and an amorphous impression for silent deposits. Domain size calculation gives a value of around 0.3μm in both the condition. The morphology of these copper deposits were systematically compared by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) methods respectively. The average grain size of Cu deposit was found in well agreement with the XRD results. A characteristic corncob like structure appears in silent Cu deposits where as the sonicated deposit is a compact one. Compositional study by EDS confers the impurity free deposit in ultrasound in terms of sulpher content and oxidation level.Resistivity measurement by four probe method further complies the EDS results.
Description: Copyright for the published article belongs to the proceedings publisher
Appears in Collections:Conference Papers

Files in This Item:
File Description SizeFormat 
seshadev-bcray-2008.pdf432.23 kBAdobe PDFView/Open

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.