Please use this identifier to cite or link to this item: http://hdl.handle.net/2080/4827
Title: Eco-Friendly Food Packaging: Chitosan-Based Biodegradable Films with Semiconductor Nanoparticles for Enhanced Shelf Life
Authors: Mohanty, Sonali
Paul, Subhankar
Keywords: Semiconductor nanoparticles
Chitosan
antibacterial
antibiofilm
food packaging
Issue Date: Nov-2024
Citation: 36th Annual Meeting of the Thai Society for Biotechnology and International Conference(ISB2024), Phra Nakhon Sri Ayutthaya, Thailand, 14-16 November 2024
Abstract: The increasing demand for food safety and environmental sustainability has led to the exploration of advanced packaging solutions that are both antimicrobial and biodegradable. This study introduces biodegradable films made from chitosan, a natural polysaccharide, infused with semiconductor nanoparticles. Characterized using Transmission Electron Microscopy (TEM), Zeta potential analysis, and Dynamic Light Scattering (DLS), the nanoparticles were optimized for size and stability. The films underwent surface characterization via Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD), and Fourier Transform Infrared Spectroscopy (FTIR), while their thermal and mechanical properties were assessed through Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), and tensile strength testing. The resulting films demonstrated enhanced mechanical strength, efficient soil degradation, and strong antibacterial activity against Gram-positive (Staphylococcus aureus, Bacillus subtilis) and Gram-negative (Escherichia coli, Pseudomonas aeruginosa) bacteria. Crucially, the films exhibited significant antibiofilm potential, inhibiting biofilm formation by over 90% for S. aureus and 80% for E. coli. This antibiofilm activity, combined with the generation of reactive oxygen species and membrane disruption, effectively extended the shelf life of perishable foods, showcasing these films as a promising, eco-friendly solution for food packaging applications
Description: Copyright belongs to the proceeding publisher
URI: http://hdl.handle.net/2080/4827
Appears in Collections:Conference Papers

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