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Please use this identifier to cite or link to this item: http://hdl.handle.net/2080/30

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contributor.authorRay, B C-
date.accessioned2005-04-27T03:24:56Z-
date.available2005-04-27T03:24:56Z-
date.issued2004-06-
identifier.citationMaterials Letters, Vol 58, Iss 16, P 2175-2177en
identifier.urihttp://hdl.handle.net/2080/30-
descriptionCopyright of this paper belongs to Elsevier Science Ltden
description.abstractThe fiber/matrix adhesion is most likely to control the overall mechanical behavior of fiber-reinforced composites. An interfacial reaction may result in various morphological modifications to polymer matrix microstructure in proximity to the fiber surface. The interactions between fiber and polymer matrix during thermal conditioning and thermal shock are important phenomena. Thermal stresses were built-up in glass fiber-reinforced epoxy composites by upthermal shock cycles (negative to positive temperature exposure) for different durations and also by downthermal shock cycles (positive to negative temperature exposure). The concentration of thermal stresses often results in weaker fiber/matrix interface. A degradative effect was observed in both modes for short shock cycles and thereafter, an improvement in shear strength was measured. The effects were shown in two different crosshead speeds during short-beam shear (SBS) test.en
format.extent305575 bytes-
format.mimetypeapplication/pdf-
language.isoen-
publisherElsevieren
subjectcomposite materialsen
subjectmechanical propertiesen
subjectadhesionen
subjectpolymersen
titleThermal shock on interfacial adhesion of thermally conditioned glass fiber/epoxy compositesen
typeArticleen
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