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dc.contributor.authorMallik, A-
dc.contributor.authorRay, B C-
dc.identifier.citation9th International Symposium on Advancement in Electrochemical Science and Technology, SAEST, Karaikudi & CECRI, Karaikudi, 2-4 December, 2010, Chennaien
dc.descriptionCopyright belongs to proceeding publisheren
dc.description.abstractThe preparation of nanostructural copper thin films has been a research hotspot in recent years due to its inimitable properties and potential applications. In this work an attempt has been made to study the coupled effect of ultrasound with varying metal ion concentration on the nucleation and growth, morphology and properties of the deposited copper thin films. Electrodeposition of copper onto a brass substrate from sulfate solution of 60 g l–1 H2SO4 at 25 ˚C are studied both in presence and absence of ultrasound at Cu (II) concentrations of 0.025, 0.05, and 0.1 M. All the chrono-amperometric (CA) experiments were performed at a negative potential of − 450 mV for 30 seconds. CA curves and theoretical instantaneous and progressive curves were used to study the synthesis mechanisms and kinetics. The thickness of films lies in the range of 400-500 nm.en
dc.format.extent1082034 bytes-
dc.subjectThin Filmsen
dc.titleImplications of bath composition and ultrasound on the structure and properties of copper thin filmsen
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