Please use this identifier to cite or link to this item: http://hdl.handle.net/2080/1468
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dc.contributor.authorMallik, A-
dc.contributor.authorRay, B C-
dc.date.accessioned2011-06-16T06:11:26Z-
dc.date.available2011-06-16T06:11:26Z-
dc.date.issued2011-
dc.identifier.citationSurface Engineering 2011 VOL 000 NO 000en
dc.identifier.urihttp://hdl.handle.net/2080/1468-
dc.descriptionCopyright belongs to Institute of Materials, Minerals and Miningen
dc.description.abstractKnowledge of internal stresses in thin copper film structures is essential in understanding the film properties, such as stress migration, adhesion, hardness and elasticity. Internal stresses and nanomechanical properties in thin copper films were investigated by the curvature method, nanoindentation and atomic force microscope. Variations in the abovementioned parameters were studied with decreasing deposition temperature for the films.Irrespective of deposition temperature, the stress was observed to be compressive and increased at low electrolyte temperatures. Hardness and elasticity of the films were found to be increased with reduced deposition temperature. With increasing compressive stress, the hardness of the films increased. The surface adhesion of the film deposited at 5uC was minimum, indicating increased cleanliness and chemical stability with low deposition temperatures.en
dc.format.extent367598 bytes-
dc.format.mimetypeapplication/pdf-
dc.language.isoen-
dc.publisherInstitute of Materials, Minerals and Mining, Maneyen
dc.subjectStressen
dc.subjectHardnessen
dc.subjectSonoelectrodepositionen
dc.subjectProfilometryen
dc.subjectCopperen
dc.titleResidual stress and nanomechanical properties of sonoelectrodeposited Cu filmsen
dc.typeArticleen
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