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Please use this identifier to cite or link to this item: http://hdl.handle.net/2080/1465

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contributor.authorMallik, A-
contributor.authorRay, B C-
date.accessioned2011-06-13T11:10:34Z-
date.available2011-06-13T11:10:34Z-
date.issued2011-05-
identifier.citation38th International conference on Metallurgical coating and thin flims, may 2-6, 2011, san diego, CA,USAen
identifier.urihttp://hdl.handle.net/2080/1465-
descriptionCopyright belongs to proceeding publisheren
description.abstractThe mechanism of electrodeposition of copper thin film on aluminum has been studied under the influence of power ultrasound using cyclic voltammetry. The deposited thin films were characterized by x-ray diffraction, scanning electron microscopy and atomic force microscopy. Films are crystalline in structure. The spherical copper domains of the deposits without sonication have been converted to mushroom structures in the presence of ultrasound. Properties, including thermal and mechanical are further analyzed using differential scanning calorimeter and nano-indentation. There is a significant change in the variation of thermal stability for films that were deposited at different bath temperatures. The observed hardness values are closely conforming to the reported data available in the open literature. Further the soft films are found to have good wear properties.en
format.extent1116286 bytes-
format.mimetypeapplication/pdf-
language.isoen-
subjectCopperen
subjectSono-electrodepositionen
subjectlow Temperatureen
subjectDSCen
subjectHardnessen
titleAn analysis of the temperature-induced supersaturation effects on structure and properties of sono-electrodeposited copper thin filmsen
typeArticleen
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