A study on thermal conductivity of aluminum nitride filled polymer composites

Please use this identifier to cite or link to this item: http://hdl.handle.net/2080/1450

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DC Field	Value	Language
dc.contributor.author	Satapathy, Alok	-
dc.contributor.author	Mohapatra, L	-
dc.contributor.author	Mishra, D	-
dc.contributor.author	Patnaik, A	-
dc.date.accessioned	2011-05-11T11:30:44Z	-
dc.date.available	2011-05-11T11:30:44Z	-
dc.date.issued	2011-05	-
dc.identifier.citation	5th PSU-UNS International Conference on Engineering and Technology (ICET-2011), Phuket, May 2-3, 2011, Prince of Songkla University, Faculty of Engineering Hat Yai, Songkhla, Thailand	en
dc.identifier.uri	http://hdl.handle.net/2080/1450	-
dc.description	Copyright belongs to proceeding publisher	en
dc.description.abstract	In this paper, finite element method (FEM) is implemented to determine the effective thermal conductivity of aluminum nitride (AlN) particulate filled epoxy matrix composites. A commercially available finite-element package ANSYS is used for this numerical analysis. Three-dimensional spheres-in-cube and cubes-in-cube lattice array models are constructed to simulate the microstructure of composite materials for various filler concentrations varying in the range of 1 to about 12 vol%. This study shows that the incorporation of aluminum nitride particles results in enhancement of conductivity of epoxy resin and thereby improves its heat conduction capability.	en
dc.format.extent	521077 bytes	-
dc.format.mimetype	application/pdf	-
dc.language.iso	en	-
dc.subject	Polymer composite	en
dc.subject	Aluminum nitride	en
dc.subject	Thermal conductivity	en
dc.subject	Finite-element method	en
dc.title	A study on thermal conductivity of aluminum nitride filled polymer composites	en
dc.type	Article	en
Appears in Collections:	Conference Papers

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