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http://hdl.handle.net/2080/1383
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| Title: | Carbon Nanotube Interconnects for VLSI Design-A state of the art |
| Authors: | Mahapatra, K K |
| Keywords: | Carbon Nanotube,
VLSI Design |
| Issue Date: | 2011 |
| Citation: | 1st International Conference on Composites and Nanocomposites, 2011, (ICNC-2011), 7-9th Jan, 2011 |
| Abstract: | In recent times CMOS processes are scaled down to nanometer regime. While scaling is a desirable feature for VLSI design, new problems have evolved particularly for interconnects. Issues like electro migration, increasing resistivity, lithography limitations and the speed/delay of the copper interconnect have driven the need to find alternate interconnects. In order to mitigate such problems, changes in materials used for on-chip interconnects have been sought. This type of phenomena occurred earlier too when transition from Aluminum to copper took place. Currently Carbon nano tubes (CNTs) have emerged as a potential candidate to supersede copper interconnects because of their ballistic transport and ability to carry large current densities in the absence of electro migration. Moreover, this material provides extremely desirable properties of high mechanical strength, thermal stability and high thermal conductivity which are absolute requirements in case of interconnects. This investig... |
| URI: | http://hdl.handle.net/2080/1383 |
| Appears in Collections: | Conference Papers
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| CNT_abs_kkm_nitr.pdf | | 195Kb | Adobe PDF | View/Open |
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