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Please use this identifier to cite or link to this item: http://hdl.handle.net/2080/1255

Title: TheThermodynamics and Kinetics Study of Growth Behavior of Sono-Electrodeposited Cu Thin Films
Authors: Rout, S
Mallik, A
Ray, B C
Keywords: Copper, Electrodeposition,
Thin-film,
Ultrasound,
DSC,
Growth
Issue Date: 2010
Citation: National Symposium for Materials Research Scholars and Workshop on Advanced Characterization Techniques (MR 10), 6-8 May, 2010, Department of Metallurgical Engineering and Materials Science, IIT Bombay, India
Abstract: The extensive use of copper thin films are in decorative, protective, electronic and magnetic devices and systems. In all of these applications, the performance and reliability of the copper films are critically determined by their microstructure, including grain shape, grain size, grain distribution, defect density and texture. These in turn are all strongly affected by the conditions under which the films are formed and can be modified through grain growth during post processing such as annealing. Thus the post synthesis thermodynamics and kinetics study of growth of films is undeniably a field of great technological importance. The application of ultrasound to crystallizing systems appears to offer significant potential for modifying and improving both the process and products. We have compared the crystallinity, composition and ex-situ growth behavior of the as-deposited copper thin films to similar films prepared under ultrasonic irradiation. Copper films have been electrodeposite...
URI: http://hdl.handle.net/2080/1255
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