DSpace@nitr >
National Institue of Technology- Rourkela >
Conference Papers >

Please use this identifier to cite or link to this item: http://hdl.handle.net/2080/1189

Authors: Nayak, R
Satapathy, Alok
Dora P, Tarkes
Kranthi, Ganguluri
Keywords: polymer composite
pine wood dust reinforcement
thermal conductivity
finite-element analysis
Issue Date: 2010
Citation: Proceedings of the International Conference on Advancements in Polymeric Materials APM 2010
Abstract: Guarded heat flow meter test method is used to measure the thermal conductivity of pine wood dust filled epoxy composites using an instrument UnithermTM Model 2022 in accordance with ASTM-E1530. In the numerical study, the finite-element package ANSYS is used to calculate the conductivity of the composites. Three-dimensional spheres-in-cube lattice array models are used to simulate the microstructure of composite materials for various filler concentrations ranging from about 6 to 36 vol%. This study reveals that the incorporation of pine wood dust results in reduction of conductivity of epoxy resin and thereby improves its thermal insulation capability. With addition of 6.5 vol% of filler, the thermal conductivity of epoxy is found to decrease by about 19.8% and with about 36 vol% of filler addition, a 57.3% reduction in thermal conductivity of neat epoxy is achieved. The experimentally measured conductivity values are compared with the numerically calculated ones and also with the alr...
URI: http://hdl.handle.net/2080/1189
Appears in Collections:Conference Papers

Files in This Item:

File Description SizeFormat
Alok Paper 2.pdf155KbAdobe PDFView/Open

Show full item record

All items in DSpace are protected by copyright, with all rights reserved.


Powered by DSpace Feedback