Please use this identifier to cite or link to this item: http://hdl.handle.net/2080/1450
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dc.contributor.authorSatapathy, Alok-
dc.contributor.authorMohapatra, L-
dc.contributor.authorMishra, D-
dc.contributor.authorPatnaik, A-
dc.date.accessioned2011-05-11T11:30:44Z-
dc.date.available2011-05-11T11:30:44Z-
dc.date.issued2011-05-
dc.identifier.citation5th PSU-UNS International Conference on Engineering and Technology (ICET-2011), Phuket, May 2-3, 2011, Prince of Songkla University, Faculty of Engineering Hat Yai, Songkhla, Thailanden
dc.identifier.urihttp://hdl.handle.net/2080/1450-
dc.descriptionCopyright belongs to proceeding publisheren
dc.description.abstractIn this paper, finite element method (FEM) is implemented to determine the effective thermal conductivity of aluminum nitride (AlN) particulate filled epoxy matrix composites. A commercially available finite-element package ANSYS is used for this numerical analysis. Three-dimensional spheres-in-cube and cubes-in-cube lattice array models are constructed to simulate the microstructure of composite materials for various filler concentrations varying in the range of 1 to about 12 vol%. This study shows that the incorporation of aluminum nitride particles results in enhancement of conductivity of epoxy resin and thereby improves its heat conduction capability.en
dc.format.extent521077 bytes-
dc.format.mimetypeapplication/pdf-
dc.language.isoen-
dc.subjectPolymer compositeen
dc.subjectAluminum nitrideen
dc.subjectThermal conductivityen
dc.subjectFinite-element methoden
dc.titleA study on thermal conductivity of aluminum nitride filled polymer compositesen
dc.typeArticleen
Appears in Collections:Conference Papers

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