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|contributor.author||Mohanty, U K (Guide)||-|
|contributor.author||Mishra, S C (Guide)||-|
|identifier.citation||Some Aspects of Performance Appraisal of Aluminum - Silicon Carbide Particulate (SiCp) Metal Matrix Composite, Thesis Submitted in Partial Fulfilment of the Requirement for the degree of Master of Technology by Research||en|
|description||Copyright for the thesis belongs to National Institute of Technology Rourkela||en|
|description.abstract||Stresses induced due to thermal mismatch between the metal matrix and the ceramic
reinforcement in metal matrix composite may impart plastic deformation to the matrix there by
resulting in a reduction of the residual stresses. Thermal mismatch strains also may quite often
crack the matrix resulting in a relaxation of the residual stresses.
The interface in MMCs is a porous, non-crystalline portion in comparison with the matrix or the
reinforcement (metal matrix and ceramic reinforcement in this case). Therefore residual stresses
are readily released at the porous and non-crystalline interface as a result of which when particle
density is high, i.e. in regions which are particle starved, meaning the availability of the interface
is limited, particle fracturing is predominating.
In the present investigation ring-shaped Al-SiCp MMCs are fabricated in the solid state
processing route. The sintering temperature and time of holding at the sintering temperature are
varied and the samples are subjected to thermal shock at +800C and at -800C in different batches.
The radial crushing strength of the specimens are determined using Instron-1195 adopting
standard test methods. Extensive micrographs of the fractured surfaces are analyzed.
Assessment and evaluation on the basis of mechanical properties reveal that thermal shock due to
a sub-ambient temperature is more damaging compared to that due to an exposure to an elevated
The micrographs studies reveal that in general when the thermal shock is due to the exposure to
an elevated temperature, the dominating failure mode is cavity generation at the interface, i.e.
nucleation and coalescence of voids foe the formation and propagation of cracks at interface
region leading to final failure. The micrographs further reveal that in the case of a thermal shock
caused due to exposure to a sub-ambient temperature, the dominating failure mode is due to
interfacial failure/or matrix damage.||en|
|title||Some Aspects of Performance Appraisal of Aluminum - Silicon Carbide Particulate (SiCp) Metal Matrix Composite||en|
|Appears in Collections:||Thesis (MTech by Research)|
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