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Please use this identifier to cite or link to this item: http://hdl.handle.net/2080/713

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contributor.authorPani, Sanjibani-
contributor.authorMohanty, U K (Guide)-
contributor.authorMishra, S C (Guide)-
identifier.citationSome Aspects of Performance Appraisal of Aluminum - Silicon Carbide Particulate (SiCp) Metal Matrix Composite, Thesis Submitted in Partial Fulfilment of the Requirement for the degree of Master of Technology by Researchen
descriptionCopyright for the thesis belongs to National Institute of Technology Rourkelaen
description.abstractStresses induced due to thermal mismatch between the metal matrix and the ceramic reinforcement in metal matrix composite may impart plastic deformation to the matrix there by resulting in a reduction of the residual stresses. Thermal mismatch strains also may quite often crack the matrix resulting in a relaxation of the residual stresses. The interface in MMCs is a porous, non-crystalline portion in comparison with the matrix or the reinforcement (metal matrix and ceramic reinforcement in this case). Therefore residual stresses are readily released at the porous and non-crystalline interface as a result of which when particle density is high, i.e. in regions which are particle starved, meaning the availability of the interface is limited, particle fracturing is predominating. In the present investigation ring-shaped Al-SiCp MMCs are fabricated in the solid state processing route. The sintering temperature and time of holding at the sintering temperature are varied and the samples are subjected to thermal shock at +800C and at -800C in different batches. The radial crushing strength of the specimens are determined using Instron-1195 adopting standard test methods. Extensive micrographs of the fractured surfaces are analyzed. Assessment and evaluation on the basis of mechanical properties reveal that thermal shock due to a sub-ambient temperature is more damaging compared to that due to an exposure to an elevated temperature. The micrographs studies reveal that in general when the thermal shock is due to the exposure to an elevated temperature, the dominating failure mode is cavity generation at the interface, i.e. nucleation and coalescence of voids foe the formation and propagation of cracks at interface region leading to final failure. The micrographs further reveal that in the case of a thermal shock caused due to exposure to a sub-ambient temperature, the dominating failure mode is due to interfacial failure/or matrix damage.en
format.extent2589142 bytes-
publisherNIT Rourkelaen
titleSome Aspects of Performance Appraisal of Aluminum - Silicon Carbide Particulate (SiCp) Metal Matrix Compositeen
Appears in Collections:Thesis (MTech by Research)

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